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 DATA SHEET
SKY77162 System Smart(R) Power Amplifier Module for CDMA / AMPS (824-849 MHz)
Applications
* Digital cellular - CDMA * Analog cellular - AMPS * Wireless local loop (WLL) The SKY77162 System Smart(R) Power Amplifier Module (PAM) is a fully matched, 8-pad, surface mount module developed for Code Division Multiple Access (CDMA), Advanced Mobile Phone Service (AMPS) and Wireless Local Loop (WLL) applications in the 824-849 MHz bandwidth. This small and efficient module packs full bandwidth coverage into a single compact package. The SKY77162 meets the stringent IS95 CDMA linearity requirements to and exceeding 28 dBm output power, and can be driven to levels beyond 31 dBm for high efficiency in FM mode operation. A low current pad (VCONT) provides improved efficiency for the low RF power range of operation. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. The output match is realized off-chip and within the module package to optimize efficiency and power performance into a 50-ohm load. This device is manufactured with Skyworks' GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77162 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. Power down is accomplished by setting the voltage on the low current reference pad to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Features
* Low voltage positive bias supply - 3.2 V to 4.2 V * Low VREF - 2.85 V, nominal * Low IREF - less than 1 mA * Good linearity * High efficiency * Large dynamic range * 8-pad package - 3 x 3 x 1.2 mm * Power down control * Dynamic bias control * InGaP * IS95 * CDMA2000 * EVDO
MODULE
VREF (4) VCONT (3) VCC2 (8) Driver Stage Bias VCC1 (1) Power Stage Bias
MMIC
Skyworks offers lead (Pb)-free "environmentally friendly" packaging that is RoHS compliant (European Parliament for the Restriction of Hazardous Substances).
RF_IN (2) GND (5, 6)
Input Match
DA
Inter-Stage Match
PA
Output Match
(7) RF_OUT
200005_001
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200005A * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * May 2, 2006
1
DATA SHEET * SKY77162
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
Electrical Specifications
The following tables list the electrical characteristics of the SKY77162 Power Amplifier. Table 1 lists the absolute maximum ratings, while Table 2 lists the recommended operating conditions for achieving the electrical performance listed in Table . Table 3 presents a truth table for the power settings.
Table 1. Absolute Maximum Ratings 1
Parameter RF Input Power Supply Voltage Reference Voltage Control Voltage Case Temperature 2 Digital Analog Symbol PIN_D PIN_A VCC VREF VCONT Operating TC Storage TSTG Minimum -- -- -- -- -- -30 -55 Nominal 0.0 3.0 3.4 2.85 TBD 25 -- Maximum 8.0 8.0 6.0 3.0 3.0 +110 +125 Volts Volts Volts C Unit dBm
1 No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value. 2 Case Operating Temperature refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Parameter Output Power Operating Frequency Supply Voltage Reference Voltage Control voltage Case Operating Temperature Digital Analog Symbol PO_D PO_A FO VCC VREF VCONT TC Minimum -- -- 824.0 3.2 2.75 1.0 -30 Nominal -- -- 836.5 3.4 2.85 -- +25 Maximum 28 31 849.0 4.2 2.95 2.0 +85 Unit dBm MHz Volts Volts Volts C
Table 3. Power Range Truth Table 1
Power Setting High Power Low Power Shut Down
meeting required linearity specification.
VREF 2.85 V 2.85 V 0.0 V
VCONT 2.0 V < 1.35 V 0.0 V
Output Power 28 dBm 0 dBm --
1 In the output power range between -10 dBm and +28 dBm, VCONT can be continuously adjusted to minimize current consumption while
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 2
May 2, 2006 * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * 200005A
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
DATA SHEET * SKY77162
Table 4. SKY77162 Electrical Specifications for Nominal Operating Conditions 1
CDMA / AMPS (Code Division Multiple Access / Advanced Mobile Phone Service)) Characteristics Symbol GLOW Digital Mode Gain Conditions GHIGH Analog Mode GP PAED_LOW Digital Mode Power Added Efficiency Analog Mode PAED_HIGH PAEA ICC_LOW Total Supply Current ICC_HIGH ICC_P Quiescent Current Reference Current Control Current 885 kHz offset Adjacent Channel Power 2,3 1.98 MHz offset Second Third ICQ_LOW ICQ_HIGH IREF ICTRL ACP1LOW ACP1HIGH ACP2LOW ACP2HIGH fO2 fO3 RxBN NF VSWR S Ru DC RF Turn Off Time 5
1 2 3
Condition VCONT 1.35 V PO_D 0 dBm VCONT = 1.8 V PO_D = 16 dBm VCONT = 2.0 V PO_D = 28 dBm VCONT = 2.08 V PO_A = 31 dBm VCONT = 1.35 V PO_D = 0 dBm VCONT = 2.0 V PO_D = 28 dBm VCONT = 2.08 V PO_A = 31 dBm VCONT = 1.35 V PO_D = 0 dBm PO_D = 28 dBm VCONT = 2.08 V PO_A = 31 dBm VCONT = 1.35 V VCONT 2.0 V VCONT = 2.0 V VCONT 1.35 V PO_D 0 dBm PO_D 28 dBm VCONT 1.35 V PO_D 0 dBm PO_D 28 dBm PO_D 31 dBm PO_D 28 dBm
Minimum 20.0 23.0 27.0 27.5 0.6 38.5 49.0 -- -- -- 25 55 0.2 100 -- -- -- -- -- -- -- -- --
Typical 21.5 25.5 28.5 28.5 0.75 40.5 55.0 40 455 673 35 71 1.0 120 -58.0 -51.0 -80.0 -59.0 -33 -60 -137 4.6 -- -- -- 40 5 40 5
Maximum 23.0 27.0
Unit
GMID
dB 30.0 30.5 -- -- -- 50 485 700 50 95 2.0 150 -50.0 -48.5 -60.0 -56.0 -30 -45 -136 -- 2:1 -70 -- -- -- -- -- s dBc VSWR s dBc mA mA A mA %
Harmonic Suppression
dBc dBm/Hz dB
Noise Power in RX Band 869-894 MHz Noise Figure Input Voltage Standing Wave Ratio Stability (Spurious output) Ruggedness--No damage 4 Turn On Time 5
5:1 VSWR all phases PO_D 28 dBm
-- 10:1 -- -- -- --
TONDC TONRF TOFFDC TOFFRF
DC RF
Per Table 2 over dynamic range up to 28 dBm output power Unless otherwise specified. ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. For CDMA2000 test configured as [PCH @ -3.75 dB, DCCH-9600 bps @ 0 dB; SCHO-9600 bps @ 0 dB] and other test configurations that yield a peak-to-average up to 4.5 dB for CCDF = 1%, up to 1. dB power back off from the maximum listed for IS95 may be required to meet specified maximum ACP performance under worst-case conditions. All phases, time = 10 seconds. TONDC is time required to reach stable quiescent bias (10%) after VREF is switched high. TOFFDC is time required for battery to decrease to < 100 A after VREF is switched low. After ICQ is stable, The TONRF is time to reach final output power (1 dB) once RF input is applied. TOFFRF is time required for PO to drop 30 dB once RF input is removed.
4 5
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200005A * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * May 2, 2006
3
DATA SHEET * SKY77162
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
Characterization Data
The following graphs illustrate the characteristics of a typical SKY77162 power amplifier designed for operation in the cellular frequency band (824-849 MHz). This amplifier was selected by characterizing a group of devices and then selecting a part with average electrical performance for both nominal and the full range of recommended operating conditions, including worst case limits. Figure 2 through 8 illustrate the digital signal characteristics of the SKY77162. Shown are power sweep characteristics for key performance parameters, over temperature and frequency, up to 28.5 dBm output power. The data was taken up to and including 16 dBm output power with the bias mode control pad setting of VCONT = 1.8 volts. Beyond 16 dBm output power, VCONT was set to 2.0 V.
31 30 VCONT = 1.8 V VCONT = 2.0 V 29 28
GAIN (dB)
27 26 25 24 23 22 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30 32
200005_002
Figure 2. Gain vs. Output Power
Legend 824.0 MHz @ -30 C 836.5 MHz @ -30 C 849.0 MHz @ -30 C 824.0 MHz @ +25 C 836.5 MHz @ +25 C 849.0 MHz @ +25 C 824.0 MHz @ +85 C 836.5 MHz @ +85 C 849.0 MHz @ +85 C
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 4
May 2, 2006 * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * 200005A
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
DATA SHEET * SKY77162
650 600 550 500 450 400 VCONT = 1.8 V VCONT = 2.0 V
ICC (mA)
350 300 250 200 150 100 50 0 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30 32
200005_003
Figure 3. Supply Current vs. Output Power
55 50 45 40 35 VCONT = 1.8 V VCONT = 2.0 V
PAE (%)
30 25 20 15 10 5 0 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30 32
200005_004
Figure 4. Power Added Efficiency vs. Output Power
Legend 824.0 MHz @ -30 C 836.5 MHz @ -30 C 849.0 MHz @ -30 C 824.0 MHz @ +25 C 836.5 MHz @ +25 C 849.0 MHz @ +25 C 824.0 MHz @ +85 C 836.5 MHz @ +85 C 849.0 MHz @ +85 C
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200005A * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * May 2, 2006
5
DATA SHEET * SKY77162
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
67 63 59 55 51 47 43 39 35 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30 32
200005_005
VCONT = 1.8 V VCONT = 2.0 V
ACPR1 (-dBc)
Figure 5. Adjacent Channel Power Ratio 1 vs. Output Power
86 82 78 74 70 66 62 58 54 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32
200005_006
VCONT = 1.8 V VCONT = 2.0 V
ACPR2 (-dBc)
POUT (dBm)
Figure 6. Adjacent Channel Power Ratio 2 vs. Output Power
Legend 824.0 MHz @ -30 C 836.5 MHz @ -30 C 849.0 MHz @ -30 C 824.0 MHz @ +25 C 836.5 MHz @ +25 C 849.0 MHz @ +25 C 824.0 MHz @ +85 C 836.5 MHz @ +85 C 849.0 MHz @ +85 C
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 6
May 2, 2006 * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * 200005A
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
DATA SHEET * SKY77162
52 50 48 46 44 VCONT = 1.8 V VCONT = 2.0 V
2F0 (-dBc)
42 40 38 36 34 32 30 0 2 4 6 8 10 12 14 16 POUT (dBm)
200005_007
18
20
22
24
26
28
30
32
Figure 7. Second Harmonic vs. Output Power
72 70 VCONT = 1.8 V VCONT = 2.0 V 68 66
3F0 (-dBc)
64 62 60 58 56 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30 32
200005_008
Figure 8. Third Harmonic vs. Output Power
Legend 824.0 MHz @ -30 C 836.5 MHz @ -30 C 849.0 MHz @ -30 C 824.0 MHz @ +25 C 836.5 MHz @ +25 C 849.0 MHz @ +25 C 824.0 MHz @ +85 C 836.5 MHz @ +85 C 849.0 MHz @ +85 C
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200005A * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * May 2, 2006
7
DATA SHEET * SKY77162
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77162, the evaluation board schematic and evaluation board assembly diagram are included for preliminary analysis and design. Figure 9 shows the basic schematic of the board for the 824 MHz to 849 MHz range.
VCC1
C2 A 330 pF
1
VCC1
VCC2
8 C5 A 330 pF C6 1000 pF C4 10 F
VCC2
RF_IN
2
RF IN
RF OUT
7
RF_OUT
VCONT
C1 1000 pF
3
VCONT
GND
6
VREF
C3 1000 pF
4
VREF
GND
5
A
Place caps at closest proximity to PA module with the capacitor grounds directly connected to the PAM grounds. Pads VCC1 and VCC2 may be connected together at the supply.
200005_009
Figure 9. Evaluation Board Schematic
P1
RF_IN SKYWORKS SOLUTIONS, INC.
C1 C2
1
J1
GND VCONT GND
J2
GND VCC1
U1
C3
VCC2
C5 C6 C4
VREF
GND
EN17-D445-001 REV 00 6/12/03 RF_OUT
COMPONENTS C1 1000 pF C2 330 pF C3 1000 pF C4 10 F C5 330 pF C6 1000 pF
200005_010
P2
Figure 10. Evaluation Board Assembly Diagram
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May 2, 2006 * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * 200005A
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
DATA SHEET * SKY77162
Package Dimensions and Pad Descriptions
The SKY77162 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 11 is a mechanical drawing of the pad layout for this package. Figure 12 provides a recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good
METAL PAD EDGE 0.4 0.03 PIN 1 LOCATOR
grounding, and minimum RF discontinuity for the 50 ohm terminals. Figure 13 shows the pad names and the pad numbering convention, which starts with pad 1 in the upper left and increments counter-clockwise around the package. Figure 14 illustrates typical case markings.
3
B C
0.4 0.03 METAL PAD EDGES (0.1) DETAIL A SMT PAD SCALE: 2X 2X THIS ROTATION 2X ROTATED 180 (0.1) 0.4 0.03 3
0.5 0.03
0.4 0.03
DETAIL B SMT PAD SCALE: 2X 1X THIS ROTATION 1X ROTATED 180 1X ROTATED 90 CW 1X ROTATED 90 CCW
0.05 A B C
TOP VIEW
2X 0.7 PIN 1 ID 8X 1.4 0.2 X 0.2
4X 1.2
A
4X 0.4
4X 1.4
2X 1.325
B
8X SMT PAD A 1.15 0.1 3X R0.2 SOLDER MASK OPENING 0.15 A B C 0.1 0.05 M A B C 0.025 M A
BOTTOM VIEW SIDE VIEW
NOTES: Unless otherwise specified 1. DIMENSIONING AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994. 2. SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT. 3. PADS ARE SOLDER MASK DEFINED ON ALL INSIDE EDGES. 4. ALL DIMENSIONS ARE IN MILLIMETERS.
200005_011
Figure 11. SKY77162 Package Dimensional Drawing (All Views)
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9
DATA SHEET * SKY77162
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
0.6
0.6
0.4
0.4 0.15
2.5
0.8 TYP
0.8 TYP
0.75
1.2 3 3.2 1.3 3 3.2
STENCIL APERTURE
TOP VIEW APPROACH 1 Component Outline Common Ground Pad 0.7
STENCIL APERTURE
TOP VIEW APPROACH 2
0.6
1.4
0.4
0.5
2.65
0.8 TYP
0.8 TYP
0.25 3 3.2
Thermal Via Array O0.3 mm on 0.5 mm Pitch Additional vias will improve thermal performance. NOTE: Thermal Vias should be tented and filled with solder mask 30-35 m Cu plating recommended
3 3.3
SOLDER MASK OPENING
TOP VIEW
ALL DIMENSIONS IN MILLIMETERS 200005_012
METALLIZATION
TOP VIEW
Figure 12. Phone PCB Layout Footprint for 3 x 3 mm, 8-Pad Package - SKY77162
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SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
DATA SHEET * SKY77162
VCC1
1
8
VCC2
RF_IN
2
7
RF_OUT
procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel - RF Modules, Document Number 101568.
VCONT
3
6
GND
VREF
4
GROUND PAD
5
GND
Electrostatic Discharge Sensitivity
The SKY77162 is a Class 2 device. Figure 15 lists the Electrostatic Discharge (ESD) immunity level for each non-ground pad of the SKY77162 product. The numbers in Figure 15 specify the ESD threshold level for each pad where the I-V curve between the pad and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pad, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization. Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after "the pad fails the electrical specification limits" or "the pad becomes completely nonfunctional". Skyworks employs most stringent criteria and fails devices as soon as the pad begins to show any degradation on a curve tracer. To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD handling precautions listed in Table 4.
Pad layout as seen from top view looking through the package. GROUND PAD is package underside. 200005_013
Figure 13. SKY77162 Pad Configuration and Pad Names (Top View)
Manufacturing Part Number Pin 1 Identifier Lot Number Year Manufactured Week Package Sealed
200005_014
77162-N NNNNN.N YYWW MX
Revision Number
Country Code
Figure 14. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77162 is capable of withstanding an MSL3/250 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 C per second; maximum temperature should not exceed 250 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 250 C for more than 10 seconds. For details on both attachment techniques, precautions, and handling
> + 2 kV < - 2 kV
VCC1
VCC2 1 8
> + 2 kV < - 2 kV
RF_IN
> + 2 kV < - 2 kV
2
7
RF_OUT
> + 2 kV < - 2 kV
VCONT
> + 2 kV < - 2 kV
3
6
GND
> + 2 kV < - 2 kV
VREF
4
GROUND PAD
5
GND
Pad layout as seen from top view looking through the package.
200005_014
Figure 15. ESD Sensitivity Areas (Top View)
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200005A2 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * May 2, 2006
11
DATA SHEET * SKY77162
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHz)
Table 4. Precautions for Handling GaAs IC-based Products to Avoid Induced Damage
Personnel Grounding Facility Wrist Straps Conductive Smocks, Gloves and Finger Cots Antistatic ID Badges Relative Humidity Control and Air Ionizers Dissipative Floors (less than 109 to GND) Dissipative Table Tops Protective Test Equipment (Properly Grounded) Grounded Tip Soldering Irons Conductive Solder Suckers Static Sensors Bags and Pouches (Faraday Shield) Protective Tote Boxes (Conductive Static Shielding) Protective Trays Grounded Carts Protective Work Order Holders
Protective Workstation
Protective Packaging & Transportation
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 12
May 2, 2006 * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * 200005A
Ordering Information
Model Number SKY77162 Manufacturing Part Number SKY77162 Product Revision Package Operating Temperature -30 C to +85 C
Revision History
Revision A Level Date May 2, 2006 Initial Release Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Application Note: Tape and Reel Information - RF Modules, Document Number 101568 JEDEC Standard J-STD-020
Copyright (c) 2004-2006, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: SkyworksTM, the Skyworks logo, and Breakthrough SimplicityTM. Product names or services listed in this publication are for identification purposes only, and may be trademarks of Skyworks or other third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.


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